Japan, Jan. 16 -- SOKEN INC,DENSO CORP has got intellectual property rights for 'ELECTRONIC KEY SYSTEM AND LOCK CONTROL DEVICE.' Other related details are as follows: Application Number: JP,2022-0924... Read More
Japan, Jan. 16 -- MITSUI HIGH TEC INC has got intellectual property rights for 'STYLUS OF CONTACT TYPE PROBE.' Other related details are as follows: Application Number: JP,2022-092094 Category (FI):... Read More
Japan, Jan. 16 -- MITSUBA CORP has got intellectual property rights for 'MAGNET ROTOR AND POWER GENERATOR.' Other related details are as follows: Application Number: JP,2022-091425 Category (FI): H0... Read More
Japan, Jan. 16 -- SHIN ETSU HANDOTAI CO LTD has got intellectual property rights for 'METHOD FOR DRY ETCHING SINGLE CRYSTAL SILICON WAFER, METHOD FOR PRODUCING SINGLE CRYSTAL SILICON WAFER, AND SINGLE... Read More
Japan, Jan. 16 -- FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD has got intellectual property rights for 'ELECTROMAGNETIC CONTACTOR.' Other related details are as follows: Application Number: JP,2022-... Read More
Japan, Jan. 16 -- COMPUTER ENGINEERING & CONSULTING LTD has got intellectual property rights for 'USER AUTHENTICATION SYSTEM, USER AUTHENTICATION SERVICE SYSTEM, USER AUTHENTICATION METHOD, AND COMPUT... Read More
Japan, Jan. 16 -- TAISEI CORP has got intellectual property rights for 'DESIGN METHOD ACCORDING TO SEQUENTIAL EXCAVATION ANALYSIS OF MOUNTAIN TUNNEL.' Other related details are as follows: Applicatio... Read More
Japan, Jan. 16 -- APIC YAMADA CORP has got intellectual property rights for 'COMPRESSION MOLDING DEVICE AND COMPRESSION MOLDING METHOD.' Other related details are as follows: Application Number: JP,2... Read More
Japan, Jan. 16 -- APIC YAMADA CORP has got intellectual property rights for 'COMPRESSION MOLDING DEVICE AND COMPRESSION MOLDING METHOD.' Other related details are as follows: Application Number: JP,2... Read More
Japan, Jan. 16 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'GRINDING METHOD FOR WORK-PIECE.' Other related details are as follows: Application Number: JP,2022-090120 Category... Read More